Wisair rolls out first complete MBOA compliant UWB chipset solution demonstrating an over-the-air wireless link
Tel Aviv, Israel – October 20, 2004 – Ultra Wide Band (UWB) chipsets and solutions leader - Wisair announces the release of the 530 Baseband chip as part of a complete chipset solution, complying with Multi-Band OFDM Alliance (MBOA) standards. The chipset, a combination of the previously announced 501 SiGe RF chip and the new 530 Baseband chip, demonstrates the company’s commitment to providing the industry with a low cost, high bit-rate UWB solution. Designed to support short range connectivity up to
480 Mbps, the solution represents the fastest commercial wireless chipset to conform to MBOA standards.
The new 530 PHY Baseband chip comprises of a full Multiband OFDM modem based on 0.13 micron CMOS technology, manufactured by TSMC. The 501 RF chip, launched six months ago, has been integrated into Wisair’s Evaluation Tool Kit system (EVT) and shipped to partners and customers, following successful demonstrations at the San Francisco Intel Developer Forum (IDF, September 7-9, 2004). The chipset, successfully tested indoors, provides an over-the-air wireless link beyond 10 meters with wireless USB
and wireless video applications.
“Wisair is the first company to provide an MBOA compliant chipset solution that can successfully demonstrate a complete over-the-air wireless UWB link. Following its proven performance, we believe the Wisair chipset solution will represent the preferred choice for commercial use by most of the industry,” said David Yaish, Wisair President and CEO. “The new Wisair chipset solution together with our reference designs will accelerate the development of truly wireless high-data rate products by partners and renowned electronic suppliers,” he added.
Consumer Electronics and PC peripherals markets are the immediate targets for development with Wisair UWB technology, as the chipset is ideal for products such as remote hard disks, digital media adaptors, camcorders, set-top boxes, digital video recorders and digital cameras to send and receive digital streams and bulk transfer of data audio and video. Wisair also targets the digital home solutions where there is
growing consumer demand for the supply of anywhere anytime content.
About Wisair
Wisair develops and markets MBOA standards based, high performance wireless communication chipset solutions, based on UWB technology. The company is an active Promoter Member in the Multi-Band OFDM Alliance Special Interest Group (MBOA-SIG), has been instrumental in the development of the MB-OFDM specifications and is also an active participant in the IEEE standardization process and WiMedia Alliance. Wisair chipsets and solutions target Consumer Electronics, PC and Mobile products, enabling the implementation of low cost, low power, and high bit-rate communication modules and system solutions for the fast emerging home/office connectivity markets.
Wisair is a privately held company founded in May 2001 as part of the RAD Group (www.rad.com). Wisair’s international offices, in the USA, Japan, Korea and Taiwan, support business development, marketing and customer activities, while its headquarters, located in Israel, provides management, research and development facilities.