Wisair Secures Over One Million Dollar Sales of its MB-OFDM UWB Development Kit
Tel Aviv, Israel, February 15, 2005 – Ultra Wide Band (UWB) chipsets and solutions leader, Wisair, today announced it achieved a major milestone, securing sales of over one million dollars of Ultra Wide Band (UWB) Development Kits (DVK). The DVK units, based on MBOA standards, have been purchased for application development by over 30 customers including; consumer electronic manufacturers, large semi-conductor brands and module manufacturers from the U.S, Asia and Europe.
“Wisair has achieved a significant step forward in establishing a broad user-base for UWB solutions, providing a strong indication of future revenue potential”, said David Yaish, Wisair President and CEO. Most development kits released to our customers signify a forthcoming UWB-based product, compliant with MBOA standards.”
Wisair’s first UWB chip was launched in April 2004, following its first UWB development and evaluation platform released two years ago. The current DVK exemplifies Wisair’s vast experience in UWB technology and maturity in chipset development, providing Wisair customers with a significant advantage in time-to-market, and enabling the company to continue to expand its customer base.
According to Wisair’s customers, the kit provides a user-friendly out-of-the-box experience with simple set up features, enabling users to quickly start evaluating the technology or start developing their applications. “The kit represented a great opportunity for our customers who were looking to simplify and accelerate the process of delivering UWB applications to end-users said Mr. Mitsuo Ukaji of Wisair-Japan, “Overall, we received tremendous customer feedback; they were impressed with the quality, flexibility and ease-of-use of the development kits.”
The DVK, based on Wisair’s low-cost, high bit rate chipset solution, enables customers to fully develop the latest UWB MBOA standard based applications. It supports point-to-point and point-to-multi-point configurations, provides multiple data interfaces and enables integration with a host of applications including; wireless USB, wireless video and wireless IP. The DVK supports data frame acknowledgements and re-transmission, providing a highly robust UWB connection over a range of 40 feet.
Eight industry leaders; ASUS, D-Link, HP, Intel, NEC Electronics, TI, and two large Japanese CE manufacturers concurrently demonstrated the latest UWB applications at the recent 2005 CES show with Wisair’s development kits. The units were employed to demonstrate wireless HDTV, wireless USB, wireless printer and wireless media adaptor applications.
About Wisair
Wisair (www.wisair.com) develops and markets MBOA standard based, high performance wireless communication chipset solutions, based on UWB technology. The company is an active Promoter Member in the Multi-Band OFDM Alliance Special Interest Group (MBOA-SIG), has been instrumental in the development of the MB-OFDM specifications and is an active participant in the IEEE standardization process, Wireless USB Promoters Group and WiMedia Alliance. Wisair solutions target Consumer Electronics, PC, mobile and automotive products, enabling the implementation of low cost, low power, and high bit-rate communication modules and system solutions for the fast emerging home/office connectivity markets. Wisair is a privately held company, founded in May 2001, as part of the RAD Group. Wisair investors include; APAX partners, Bynet VC, Intel, NIF, NTT Leasing, RAD VC, Tamar and Vertex. Wisair’s international offices, in the USA, Japan, Korea and Taiwan, support business development, marketing and customer activities, while its headquarters, located in Israel, provides management, research and development facilities.